본아덴
(Von Ardenne)
프로세스 솔루션
검증된 부품(Proven Components), 탁월한 결과(Excellent results)
고객이 부품 및 프로세스 솔루션 공급업체에게서 찾고 있는 것은 무엇인가? 경험? 신뢰성? 입증된 실적?
본아덴 장비는 50개국 이상에서 사용되고 있습니다.
본아덴은 전 세계적으로 수백 대의 코팅 시스템의 판매 설치를 했는데, 소형부터 대형까지와 다양한 사이즈와 어플리케이션에 적용되고 있습니다.
항상 우리 고객들은 선도적인 위치에 머물러야 하는 도전에 직면해 왔습니다.
그것이 바로 본아덴 프로세스 솔루션을 파트너로 선택하는 이유입니다. 성공을 위한 열쇠는 브로셔를 참조하시길 바랍니다.
MISSION
본아덴(Von Ardenne)은 업계 최고의 기술과 프로세스 경험을 고객에게 제공하여 가치를 창출하는 것이 최종 목표입니다. 동급 최강의 성능 사양과 신뢰성을 갖춘 최첨단 하드웨어 솔루션을 제공함으로써 이를 달성하고자 합니다.
또한, 본아덴(Von Ardenne)은 단일막 또는 복잡한 다층막 증착 사양의 프로세스를 제어하기 위한 첨단 프로세스 제어 하드웨어 및 소프트웨어 솔루션을 제공합니다. 고객의 사양과 일정에 따라 보증된 프로세스 결과를 전달하는 것이 우리의 목표입니다. 그리고 우리는 고객이 원하는 제품을 제공할 수 있다고 확신합니다.
End blocks
X-Series
- Cartridge design for all ware parts for easy and fast maintenance
- Modular end block design with only a few parts to be changed while maintenance and easy adaption of different further process components (e.g. other magnet bars)
- No deinstallation of end block for maintenance
- Long time operation and low cost of ownership
- “O” bearing provides rigid alignment between shaft & seals for bearing life time > 10 years
- Flexible end block mount for 5x higher target compliance without rotary seal risk
- Easy to use X-series tool kit
Y-Series
- Single-sided design
- Cartridge design for all ware parts for easy and fast maintenance
- Modular end block design with only a few parts to be changed while maintenance and easy adaption of different further process components (e.g. other magnet bars)
- No deinstallation of end block for basic maintenance
- Long time operation and low cost of ownership
- Easy to use Y-series tool kit
Magnet bars
RVA30 – RVA50 – RVA70 – RVA100
- Best in class magnetic field uniformity for optimum layer uniformity
- Optimized race track return design interchangeable by different end caps for high target utilization, less arcing and particles uniform layer properties over full substrate and uniform sputter rate over target life time
- Variable sputter angle from ± 15° to ± 60° for better process coupling or reduced process voltage
- Long time technological experience in all fields of coating applications which flows into magnetic field design
Planar cathodes
WSM – HU-WSM – Planar XT
- State-of-the-art magnetic field uniformity for optimum layer uniformity
- Optimized race track return design for high target utilization at target ends, uniform layer properties over full substrate and uniform sputter rate over target life time
- State of the art magnetic field shape for higher target utilization over full target length
- Different target mountings (customer’s choice: direct screwed, clamped, hidden clamping, hot clamping)
- Varying magnetron width to fit customer’s needs in terms of space for installation
- Long time technological experience in all fields of coating applications which flows into magnetic field design
Process control system
VA PROCOS 2
- Closed loop control
- Stabilization of process, reduction of loss, higher sputter rate
- Automatic on-line balancing
- Modular set-up
- Various control features – optical emission, plasma voltage, oxygen partial pressure, generic -10V to +10V
Complete magnetrons
Wide range of DC and AC solutions
- Long time experience in designing and using of complete magnetron systems for all applications with high technological performance
– R2R, vertical, horizontal,
– hot processes,
– internal or external designs,
– direct or indirect pumped,
– with gas manifold or without
– different anode solutions
- Equipped with state-of-the-art sputter components
- Different anode solutions available
- Can be equipped with different gas inlet solutions (multi-segmented, binary structure)
PECVD Sources
Hollow cathode PECVD Source
- Simple and scalable design for robust behavior and easy customization
- High density plasma processing at low costs
- Low discharge voltage for gentle processing
- Broad process window
Capacitively Coupled Plasma PECVD Source
- Scalable high throughput option for all CCP CVD processes
- Dynamic deposition on various substrates
- High layer homogeneities
- Long campaign deposition
- High durability
- Maintenance free
Hot WIRE CVD Source
- Divided source design with separated wire mounting for quick exchange and process restart
- No plasma process: no ion bombardment, no field accelerated electrons
- Inherently free of dust
- Deposition rate up to 10x higher compared with PECVD processes
Surface Pre-Treatment
Linear Ion Source
- simple and robust design for production environment
- scalable design for easy fitting
- highly energetic and strongly focused beam
- pre-treatment for different substrate materials
- excellent etching uniformity
